This work, which considers the chemistry of metals, includes methods of preparing ultra-thin metal films and chemical vapour deposition (CVD), with an emphasis on microelectronics applications. Chapter One, an introduction, discusses the applications of metal CVD as well as the types of processes used for metal deposition, and rationalizes which materials are used and why they are chosen. Chapters Two through Eight discuss CVD of Al (2), W (3), Cu from Cu(II) precursors (4), Cu from Cu(I) precursors (5), Au and Ag (6), Pt, Pd and Ni (7), and CVD of Ta, Cr, Mo, Fe, Co, Rh, Ir and less common metals (8). Chapter 9 summarizes the results from these chapters. Some fundamental physical and chemical phenomena that occur in CVD reactors are also discussed to provide a basis from which data in the literature can be interpreted. The goal of this work is to bring together all aspects of the CVD of metals in a way that is useful for all those who work in this field. The book should be suitable for scientists developing novel coating techniques.

 

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